Project monitoring:

Dipl.-Ing. Markus Hacksteiner

The goal was to deposit copper on surface structured substrates covered with tantalum and other substances with a uniform thickness and complete filling of cavities. The dimensions of the surface structures lay in the range of nanometers. Liquid ammonia was applied as a solvent. The process development was carried out at room temperature

Zyklisches Voltammogramm
Glove Box